Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: FBGA-676
External dimensions/length: 27 mm
External dimensions/width: 27 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA-676
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE1500-2FGG676
|
Microsemi | 完全替代 | FBGA-676 |
FPGA ProASIC®3E Family 1.5M Gates 310MHz 130nm Technology 1.5V 676Pin FBGA
|
||
A3PE1500-2FGG676
|
SOC | 完全替代 | BGA-676 |
FPGA ProASIC®3E Family 1.5M Gates 310MHz 130nm Technology 1.5V 676Pin FBGA
|
||
A3PE1500-FG676I
|
Microsemi | 类似代替 | FBGA-676 |
FPGA - 现场可编程门阵列 ProASIC3
|
||
A3PE1500-FG676I
|
SOC | 类似代替 | BGA-676 |
FPGA - 现场可编程门阵列 ProASIC3
|
||
M1A3PE1500-FGG676
|
SOC | 完全替代 | BGA-676 |
FPGA ProASIC3E Family 1.5M Gates 231MHz 130nm Technology 1.5V 676Pin FBGA
|
||
M1A3PE1500-FGG676
|
Microsemi | 完全替代 | FBGA-676 |
FPGA ProASIC3E Family 1.5M Gates 231MHz 130nm Technology 1.5V 676Pin FBGA
|
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