Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: FBGA-676
External dimensions/packaging: FBGA-676
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE1500-FGG676
|
Microsemi | 完全替代 | FBGA-676 |
Field Programmable Gate Array, 38400 CLBs, 1500000Gates, 350MHz, 38400-Cell, CMOS, PBGA676, 27 X 27MM, 2.23MM HEIGHT, 1MM PITCH, GREEN, FBGA-676
|
||
|
|
SOC | 完全替代 | BGA-676 |
Field Programmable Gate Array, 38400 CLBs, 1500000Gates, 350MHz, 38400-Cell, CMOS, PBGA676, 27 X 27MM, 2.23MM HEIGHT, 1MM PITCH, FBGA-676
|
||
M1A3PE1500-FGG676
|
SOC | 完全替代 | BGA-676 |
FPGA ProASIC3E Family 1.5M Gates 231MHz 130nm Technology 1.5V 676Pin FBGA
|
||
M1A3PE1500-FGG676
|
Microsemi | 完全替代 | FBGA-676 |
FPGA ProASIC3E Family 1.5M Gates 231MHz 130nm Technology 1.5V 676Pin FBGA
|
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