Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-676
External dimensions/packaging: BGA-676
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE1500-1FG676I
|
Microsemi | 完全替代 | FBGA-676 |
FPGA ProASIC®3E Family 1.5M Gates 272MHz 130nm Technology 1.5V 676Pin FBGA
|
||
M1A3PE1500-2FGG676I
|
Microsemi | 完全替代 | FBGA-676 |
FPGA ProASIC3E Family 1.5M Gates 310MHz 130nm Technology 1.5V 676Pin FBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review