Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: FBGA-676
External dimensions/length: 27 mm
External dimensions/width: 27 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA-676
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE1500-FG676I
|
Microsemi | 完全替代 | FBGA-676 |
FPGA - 现场可编程门阵列 ProASIC3
|
||
A3PE1500-FG676I
|
SOC | 完全替代 | BGA-676 |
FPGA - 现场可编程门阵列 ProASIC3
|
||
|
|
Actel | 完全替代 | FBGA-676 |
FPGA ProASIC3E Family 1.5M Gates 231MHz 130nm Technology 1.5V 676Pin FBGA
|
||
|
|
SOC | 完全替代 | BGA-676 |
Field Programmable Gate Array, 38400 CLBs, 1500000Gates, 350MHz, 38400-Cell, CMOS, PBGA676, 27 X 27MM, 2.23MM HEIGHT, 1MM PITCH, FBGA-676
|
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