Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SO-8
External dimensions/width: 3.9 mm
External dimensions/packaging: SO-8
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI4778DY-T1-GE3
|
Vishay Semiconductor | 类似代替 | SOIC-8 |
MOSFET N-CH 25V 8A 8-SOIC
|
||
SI4778DY-T1-GE3
|
Vishay Intertechnology | 类似代替 | SOIC-8 |
MOSFET N-CH 25V 8A 8-SOIC
|
||
SI4778DY-T1-GE3
|
Vishay Siliconix | 类似代替 | SOIC-8 |
MOSFET N-CH 25V 8A 8-SOIC
|
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