Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI4778DY-T1-E3
|
Vishay Intertechnology | 类似代替 | SO-8 |
Trans MOSFET N-CH 25V 8A 8Pin SOIC N T/R
|
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