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Model BC857A

Description MULTICOMP BC857A Single transistor bipolar, PNP, -45 V, 100 MHz, 250 mW, -100 mA, 125 hFE

Brand: Multicomp

Packaging SOT-23

Delivery time

Packaging method

Standard packaging quantity 1

20+:

$ 0.2754

50+:

$ 0.2550

100+:

$ 0.2448

300+:

$ 0.2366

500+:

$ 0.2305

1000+:

$ 0.2264

5000+:

$ 0.2224

10000+:

$ 0.2183

Price	$ 0.2754	$ 0.2550	$ 0.2448	$ 0.2366	$ 0.2305
Start batch production	20+	50+	100+	300+	500+

Freight charges： In stock Freight rate：$13.00

Quantity：

Inventory(8731) Minimum order quantity(20)

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Specification parameters
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Technical parameters/number of pins: 3

Technical parameters/polarity: PNP

Technical parameters/dissipated power: 250 mW

Technical parameters/DC current gain (hFE): 125

Technical parameters/operating temperature (Max): 150 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 3

Encapsulation parameters/Encapsulation: SOT-23

External dimensions/packaging: SOT-23

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/REACH SVHC standards: No SVHC

Compliant with standard/REACH SVHC version: 2016/06/20

Alternative material

Model	Brand	Similarity	Encapsulation	Introduction	Data manual
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BC856B	Infineon	功能相似	SOT-23	Small Signal Bipolar Transistor, 0.1A I(C), 65V V(BR)CEO, 1Element, PNP, Silicon, TO-236, ROHS COMPLIANT, PLASTIC PACKAGE-3	PDF
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BC856B	CJ	功能相似	SOT-23-3	Small Signal Bipolar Transistor, 0.1A I(C), 65V V(BR)CEO, 1Element, PNP, Silicon, TO-236, ROHS COMPLIANT, PLASTIC PACKAGE-3	PDF
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BC857ALT1G	ON Semiconductor	功能相似	SOT-23-3	PNP 晶体管，ON Semiconductor 这些 ON Semiconductor 双极晶体管可放大模拟或数字信号。它们还可切换直流或用作振荡器。 ### 标准 Manufacturer Part Nos with S or NSV prefix are automotive qualified to AEC-Q101 standard. ### 双极性晶体管，On Semiconductor ON Semiconductor 的各种双极晶体管，包括以下类别：小信号晶体管通用晶体管双 NPN 和 PNP 晶体管功率晶体管高电压晶体管射频双极晶体管低噪声，双匹配和复杂的双极晶体管	PDF
BC857AMTF	Fairchild	功能相似	SOT-23-3	PNP 晶体管，40 至 50V，Fairchild Semiconductor ### 双极晶体管，Fairchild Semiconductor 双极性结点晶体管 (BJT) 板系列提供完整的解决方案，用于满足各种电路应用需求。创新的封装设计用于提供最小尺寸、最高可靠性和最大热性能。	PDF
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