Technical parameters/access time: 34 ns
Technical parameters/power supply voltage: 4.5V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/length: 10.4 mm
External dimensions/width: 7.6 mm
External dimensions/height: 2.34 mm
External dimensions/packaging: SOIC-16
External dimensions/thickness: 2.34 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 完全替代 | CDIP-16 |
IC FIFO ASYNC 64X4 16CDIP
|
||
IDT72401L25DB
|
Integrated Device Technology | 功能相似 | DIP |
CMOS并行FIFO 64× 4和64 ×5 CMOS PARALLEL FIFO 64 x 4 and 64 x 5
|
||
IDT72403L25P
|
Integrated Device Technology | 功能相似 | DIP |
CMOS并行FIFO 64× 4 -bit和64 ×5位 CMOS PARALLEL FIFO 64 x 4-BIT AND 64 x 5-BIT
|
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