Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 功能相似 | CDIP-16 |
IC FIFO ASYNC 64X4 16CDIP
|
||
72401L25SO8
|
Integrated Device Technology | 功能相似 | SOIC-16 |
先进先出 64X4 HIGH SPEED CMOS 先进先出
|
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