Technical parameters/access time: 34 ns
Technical parameters/power supply voltage: 4.5V ~ 5.5V
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: CDIP-16
External dimensions/length: 20.0 mm
External dimensions/width: 7.62 mm
External dimensions/packaging: CDIP-16
External dimensions/thickness: 3.43 mm
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72401L25SO8
|
Integrated Device Technology | 完全替代 | SOIC-16 |
先进先出 64X4 HIGH SPEED CMOS 先进先出
|
||
IDT72403L25P
|
Integrated Device Technology | 功能相似 | DIP |
CMOS并行FIFO 64× 4 -bit和64 ×5位 CMOS PARALLEL FIFO 64 x 4-BIT AND 64 x 5-BIT
|
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