Technical parameters/number of contacts: 28
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 3 A
Technical parameters/insulation resistance: 5000 MΩ
Technical parameters/number of rows: 2
Technical parameters/Flammability level: UL 94 V-0
Technical parameters/number of pins: 28
Technical parameters/Contact resistance: 10 mΩ
Technical parameters/rated current (Max): 3A/contact
Technical parameters/operating temperature (Max): 105 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/Contact resistance (Max): 10 mΩ
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 35.56 mm
External dimensions/width: 17.78 mm
External dimensions/height: 4.57 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/color: Black
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 125℃
Physical parameters/shell material: Polyester
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Other/Manufacturing Applications: Signal
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536694040
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
110-13-628-41-001000
|
Mill-Max | 功能相似 | DIP |
MILL MAX 110-13-628-41-001000 芯片插座, DIP-28, 通孔安装
|
||
110-93-628-41-801000
|
Mill-Max | 功能相似 | DIP |
MILL MAX 110-93-628-41-801000 芯片插座, DIP, 28路, 通孔安装
|
||
SPC15523
|
Multicomp | 类似代替 |
MULTICOMP SPC15523 芯片插座, DIP, 触点数:28, 排距:0.3"", 1A
|
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