Technical parameters/number of contacts: 28
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 1.00 A
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
4-1571552-9
|
TE Connectivity | 功能相似 |
TE CONNECTIVITY 4-1571552-9. 芯片插座, DIP, 触点数:28, 排距:0.6""
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|
Augat | 类似代替 |
DIP SOCKET, 28POS, THROUGH HOLE
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828-AG10D
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Buchanan | 类似代替 |
DIP SOCKET, 28POS, THROUGH HOLE
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828-AG10D
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TE Connectivity | 类似代替 |
DIP SOCKET, 28POS, THROUGH HOLE
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828-AG10D
|
Tyco Electronics | 类似代替 |
DIP SOCKET, 28POS, THROUGH HOLE
|
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