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Description MULTICOMP SPC15523 Chip socket, DIP, number of contacts: 28, row spacing: 0.3 ", 1A
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Packaging
Delivery time
Packaging method
Standard packaging quantity 1
14.06  yuan 14.06yuan
5+:
$ 16.4525
50+:
$ 15.7494
200+:
$ 15.3557
500+:
$ 15.2573
1000+:
$ 15.1588
2500+:
$ 15.0463
5000+:
$ 14.9760
7500+:
$ 14.9057
Quantity
5+
50+
200+
500+
1000+
Price
$16.4525
$15.7494
$15.3557
$15.2573
$15.1588
Price $ 16.4525 $ 15.7494 $ 15.3557 $ 15.2573 $ 15.1588
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(5433) Minimum order quantity(5)
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Technical parameters/number of contacts: 28

Technical parameters/Contact electroplating: Gold

Technical parameters/rated current: 1.00 A

Encapsulation parameters/installation method: Through Hole

Packaging parameters/pin spacing: 2.54 mm

External dimensions/pin spacing: 2.54 mm

Physical parameters/contact material: Beryllium Copper

Other/Product Lifecycle: Unknown

Compliant with standards/RoHS standards: RoHS Compliant

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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TE CONNECTIVITY 4-1571552-9. 芯片插座, DIP, 触点数:28, 排距:0.6""
PDF
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