Technical parameters/number of contacts: 28
Technical parameters/Contact electroplating: Gold, Tin
Technical parameters/rated voltage (DC): 50.0 V
Technical parameters/rated current: 3 A
Technical parameters/number of rows: 2
Technical parameters/number of pins: 28
Technical parameters/number of plug and unplug cycles: 100
Technical parameters/installation angle: 180 °
Technical parameters/rated current (Max): 3 A
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/rated voltage: 150VDC, 100VAC
Technical parameters/Contact resistance (Max): 10 mΩ
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: DIP
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 35.5 mm
External dimensions/width: 17.7 mm
External dimensions/height: 4.19 mm
External dimensions/packaging: DIP
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Augat | 功能相似 |
AMP FROM TE CONNECTIVITY 828-AG10D 芯片插座, DIP, 触点数:28, 排距:0.6""
|
|||
828-AG10D
|
Buchanan | 功能相似 |
AMP FROM TE CONNECTIVITY 828-AG10D 芯片插座, DIP, 触点数:28, 排距:0.6""
|
|||
828-AG10D
|
TE Connectivity | 功能相似 |
AMP FROM TE CONNECTIVITY 828-AG10D 芯片插座, DIP, 触点数:28, 排距:0.6""
|
|||
828-AG10D
|
Tyco Electronics | 功能相似 |
AMP FROM TE CONNECTIVITY 828-AG10D 芯片插座, DIP, 触点数:28, 排距:0.6""
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review