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Model BSM150GB170DN2
Description IGBTPower module (half bridge including fast freewheeling diode packaging with insulated metal substrate) IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
Product QR code
Brand: Infineon
Packaging 62MM
Delivery time
Packaging method
Standard packaging quantity 1
663.48  yuan 663.48yuan
1+:
$ 756.3661
10+:
$ 729.8269
50+:
$ 726.5095
100+:
$ 723.1921
150+:
$ 717.8843
250+:
$ 713.2399
500+:
$ 708.5956
1000+:
$ 703.2877
Quantity
1+
10+
50+
100+
150+
Price
$756.3661
$729.8269
$726.5095
$723.1921
$717.8843
Price $ 756.3661 $ 729.8269 $ 726.5095 $ 723.1921 $ 717.8843
Start batch production 1+ 10+ 50+ 100+ 150+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9274) Minimum order quantity(1)
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Encapsulation parameters/installation method: Screw

Package parameters/number of pins: 7

Encapsulation parameters/Encapsulation: 62MM

External dimensions/packaging: 62MM

Other/Product Lifecycle: Obsolete

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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IGBT功率模块（半桥包括快速续流二极管封装用绝缘金属基板） IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
PDF
BSM100GB170DN2 BSM100GB170DN2 Siemens Semiconductor 功能相似
IGBT功率模块（半桥包括快速续流二极管封装用绝缘金属基板） IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
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BSM150GB170DLC BSM150GB170DLC Infineon 功能相似 62MM
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BSM150GB170DLC BSM150GB170DLC Eupec 功能相似
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