Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: TQFP-144
External dimensions/packaging: TQFP-144
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3S50-4TQG144C
|
Xilinx | 完全替代 | TQFP-144 |
XC3S50 4TQG144C 磨码
|
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XC3S50-4TQG144I
|
Xilinx | 完全替代 | TQFP-144 |
XC3S50 4TQG144I 磨码
|
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XC3S50-5TQG144C
|
Xilinx | 完全替代 | TQFP-144 |
现场可编程门阵列,Xilinx ### 现场可编程门阵列 (FPGA) FPGA 是一种半导体设备,包含通过可编程互连连接的可配置逻辑块 (CLB) 矩阵。 用户通过编程 SRAM 确定这些互连。 CLB 可以简单(与或门等),也可以复杂(RAM 块)。 FPGA 允许对设计进行更改,即使在设备焊接到印刷电路板上之后。
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