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Description Field Programmable Gate Array (FPGA) is a semiconductor device that includes a configurable logic block (CLB) matrix connected through programmable interconnects. The user determines these interconnections by programming SRAM. CLB can be simple (such as OR gates) or complex (such as RAM blocks). FPGA allows for design modifications, even after the device is soldered onto a printed circuit board.
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Brand: Xilinx
Packaging TQFP-144
Delivery time
Packaging method Each
Standard packaging quantity 1
82.65  yuan 82.65yuan
1+:
$ 95.0464
10+:
$ 90.9139
100+:
$ 90.1701
250+:
$ 89.5915
500+:
$ 88.6824
1000+:
$ 88.2691
2500+:
$ 87.6906
5000+:
$ 87.1947
Quantity
1+
10+
100+
250+
500+
Price
$95.0464
$90.9139
$90.1701
$89.5915
$88.6824
Price $ 95.0464 $ 90.9139 $ 90.1701 $ 89.5915 $ 88.6824
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(4564) Minimum order quantity(1)
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Technical parameters/frequency: 725 MHz

Technical parameters/RAM size: 9216 B

Technical parameters/number of logic gates: 50000

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 1.14V ~ 1.26V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 144

Encapsulation parameters/Encapsulation: TQFP-144

External dimensions/length: 20 mm

External dimensions/width: 20 mm

External dimensions/height: 1.4 mm

External dimensions/packaging: TQFP-144

Physical parameters/operating temperature: 0℃ ~ 85℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Each

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
XC3S50-4TQG144C XC3S50-4TQG144C Xilinx 完全替代 TQFP-144
XC3S50 4TQG144C 磨码
PDF
XC3S50-4TQG144I XC3S50-4TQG144I Xilinx 完全替代 TQFP-144
XC3S50 4TQG144I 磨码
PDF

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