Technical parameters/frequency: 238 MHz
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.25V ~ 5.25V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 329
Encapsulation parameters/Encapsulation: BGA-329
External dimensions/packaging: BGA-329
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
Customs information/ECCN code: 3A991.d
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 类似代替 | BBGA-329 |
FPGA SX Family 32K Gates 1800 Cells 320MHz 0.35um Technology 3.3V/5V 329Pin BGA
|
||
A54SX32-2BG329
|
Microsemi | 类似代替 | BGA-329 |
FPGA SX Family 32K Gates 1800 Cells 320MHz 0.35um Technology 3.3V/5V 329Pin BGA
|
||
A54SX32A-1BGG329I
|
Microsemi | 完全替代 | BBGA-329 |
Field Programmable Gate Array, 2880 CLBs, 48000Gates, 278MHz, 2880-Cell, CMOS, PBGA329, 1.27MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-329
|
||
|
|
Microchip | 完全替代 | BGA |
Field Programmable Gate Array, 2880 CLBs, 48000Gates, 278MHz, 2880-Cell, CMOS, PBGA329, 1.27MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-329
|
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