Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BBGA-329
External dimensions/packaging: BBGA-329
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
Microchip | 完全替代 | BGA |
Field Programmable Gate Array, 2880 CLBs, 48000Gates, 278MHz, 2880-Cell, CMOS, PBGA329, 1.27MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-329
|
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