Technical parameters/number of logic gates: 32000
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.25V ~ 5.25V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 329
Encapsulation parameters/Encapsulation: BBGA-329
External dimensions/packaging: BBGA-329
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A54SX32A-1BGG329
|
Microsemi | 类似代替 | BBGA-329 |
FPGA - 现场可编程门阵列 A54SX32A-1BGG329
|
||
A54SX32A-1BGG329
|
SOC | 类似代替 | BBGA-329 |
FPGA - 现场可编程门阵列 A54SX32A-1BGG329
|
||
A54SX32A-BG329I
|
Microsemi | 完全替代 | BGA-329 |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 329Pin BGA
|
||
A54SX32A-BGG329
|
Microsemi | 类似代替 | BBGA-329 |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 329Pin BGA
|
||
A54SX32A-BGG329
|
Actel | 类似代替 | BGA |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 329Pin BGA
|
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