Technical parameters/number of channels: | 1 |
|
Technical parameters/drain source resistance: | 18.5 mΩ |
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Technical parameters/polarity: | N-Channel |
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Technical parameters/dissipated power: | 68 W |
|
Technical parameters/drain source voltage (Vds): | 60 V |
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Technical parameters/Leakage source breakdown voltage: | 60 V |
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Technical parameters/Continuous drain current (Ids): | 30.0 A |
|
Technical parameters/rise time: | 20 ns |
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Technical parameters/Input capacitance (Ciss): | 1725pF @25V(Vds) |
|
Technical parameters/rated power (Max): | 68 W |
|
Technical parameters/descent time: | 8 ns |
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Technical parameters/operating temperature (Max): | 175 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/dissipated power (Max): | 68W (Tc) |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 3 |
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Encapsulation parameters/Encapsulation: | TO-252-3 |
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Dimensions/Length: | 6.73 mm |
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Dimensions/Width: | 6.22 mm |
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Dimensions/Height: | 2.38 mm |
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Dimensions/Packaging: | TO-252-3 |
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Physical parameters/operating temperature: | -55℃ ~ 175℃ (TJ) |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
FDD5690
|
Fairchild | 类似代替 | TO-252-3 |
ON Semiconductor PowerTrench 系列 Si N沟道 MOSFET FDD5690, 30 A, Vds=60 V, 3引脚 DPAK (TO-252)封装
|
||
|
|
Rochester | 类似代替 | TO-252 |
ON Semiconductor PowerTrench 系列 Si N沟道 MOSFET FDD5690, 30 A, Vds=60 V, 3引脚 DPAK (TO-252)封装
|
||
NTD32N06G
|
ON Semiconductor | 类似代替 | TO-252-3 |
60V,32A,N沟道MOSFET
|
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