Technical parameters/digits: | 16 |
|
Technical parameters/access time (Max): | 0.195 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Package parameters/number of pins: | 96 |
|
Encapsulation parameters/Encapsulation: | BGA |
|
Dimensions/Height: | 0.8 mm |
|
Dimensions/Packaging: | BGA |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W631GG6KB15I
|
Winbond Electronics | 类似代替 | BGA |
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA
|
||
W631GG6KB15K
|
Winbond Electronics | 功能相似 | TFBGA |
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V Automotive 96Pin WBGA
|
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