Technical parameters/power supply current: 240 mA
Technical parameters/digits: 16
Technical parameters/access time (Max): 0.255 ns
Technical parameters/operating temperature (Max): 95 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 96
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W631GG6KB-11
|
Winbond Electronics | 类似代替 | BGA |
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA
|
||
W631GG6KB-12
|
Winbond Electronics | 功能相似 | TFBGA-96 |
DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 13MM, 0.8MM PITCH, ROHS COMPLIANT, WBGA-96
|
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