Package parameters/number of pins: 96
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W631GG6KB-11
|
Winbond Electronics | 功能相似 | BGA |
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA
|
||
W631GG6KB15I
|
Winbond Electronics | 功能相似 | BGA |
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA
|
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