Encapsulation parameters/Encapsulation: | TFBGA |
|
Dimensions/Packaging: | TFBGA |
|
Other/Product Lifecycle: | Obsolete |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W631GG6KB-11
|
Winbond Electronics | 功能相似 | BGA |
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA
|
||
W631GG6KB15I
|
Winbond Electronics | 功能相似 | BGA |
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96Pin WBGA
|
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