Gowin Semiconductor's GW5AT-LV60UG324 high-performance FPGA has been honored with the "Top 10 Integrated Circuit Innovation Achievements" award at a Shandong province tech event, highlighting the advancing capabilities of domestic FPGA technology.
The award recognizes outstanding innovation in the IC sector, and Gowin's selection reflects both technical sophistication and industrial applicability. The FPGA is manufactured on a 22nm process and integrates multiple self-developed high-speed hard IP cores, including SerDes, MIPI C-PHY, and D-PHY, enabling deployment in video, automotive, and industrial applications.
Key performance metrics underscore its competitiveness:
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C-PHY supports 2.5Gsps per lane with 17.25Gbps total bandwidth.
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D-PHY achieves 3Gbps.
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PCIe 3.0 supports 8Gbps per lane.
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Four SerDes lanes exceed 12.5Gbps.
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GPIO interface speed reaches 2Gbps.
The chip also integrates temperature/voltage monitoring ADCs and a high-speed SAR ADC. An automotive-grade version meets AEC-Q100 Grade 1 standards, ensuring reliability across a wide temperature range for demanding industrial and automotive environments.
The award validates Gowin's focus on indigenous innovation and signals progress in Shandong's semiconductor industry ecosystem.
ICgoodFind: This award underscores the growing maturity and market relevance of China's domestic FPGA solutions in competitive application areas.
