At the 4th BeiDou Scale Application International Summit on September 24, Shenzhen Huada Beidou Technology unveiled its new-generation BeiDou-3 Short Message Communication SoC chip, the HD6180. This fully independent RF-and-baseband integrated chip achieves significant improvements in performance, power efficiency, and integration.
Built on a 22nm process, the HD6180 enhances system performance while reducing power consumption, making it ideal for smartphones and wearable devices. It adopts a more challenging RDSS transceiver-integrated architecture, optimizing chip area and cost. The packaged size is only 3mm×3mm, supporting further device miniaturization.
Key features include:
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Weak signal decoding sensitivity improved to -130dBm for stable communication in extreme conditions
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First satellite acquisition time under 2 seconds for faster positioning and communication
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Support for dual-mode (T/P) decoding adaptable to industrial and consumer scenarios
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Operating power consumption below 22mW, over 80% lower than mainstream solutions
As a unique feature of the BeiDou system, short message communication enables two-way satellite texting in areas without mobile or internet coverage, ensuring communication reliability in emergencies.
ICgoodFind : The HD6180 demonstrates advanced domestic chip capabilities, accelerating BeiDou's adoption in consumer electronics and emergency rescue markets.
