South Korean wafer equipment manufacturer Hanmi Semiconductor has announced that its hybrid bonding machine is set to begin sales in 2027, signaling a major advancement in chip packaging technology.
During a shareholders’ meeting at the company’s Incheon headquarters, CFO Mave Kim outlined the roadmap:
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2027: Introduction of a hybrid bonder for High Bandwidth Memory (HBM) production
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2028: Launch of a hybrid bonder for System-on-Chip (SoC) applications
Unlike the Thermal Compression (TC) bonders currently used in HBM packaging, hybrid bonding technology directly bonds chips without bumps, enabling thinner HBM stacks and significantly reducing signal loss for improved performance.
Kim revealed that Hanmi Semiconductor produced its first hybrid bonding machine as early as 2020, positioning itself ahead of competitors like Han Semiconductor. Currently, Hanmi and ASMPT are the only two companies globally capable of producing TC bonders required for HBM4 production.
Regarding international trade, Kim noted that the company primarily exports equipment to Taiwan and Singapore and does not expect immediate impact from U.S. tariffs.
ICgoodFind Summary: The commercialization of hybrid bonding is set to accelerate advanced packaging development, with Hanmi well-positioned to capture opportunities in HBM and SoC equipment markets.
