Description:
BGA Heatsink, Push Pin Push pin type BGA heatsink suitable for surface mount chip cooling and various other applications. ### BGA radiator
Description:
T0220 Clamp type, 9 ° C/W, 11 ° C/W It is recommended to test the efficiency of various heat sinks in the specific working environment they will face # # # Transistor type packaging, up to 48 ° C/W
Description:
BGA Heatsink, Push Pin Push pin type BGA heatsink suitable for surface mount chip cooling and various other applications. ### BGA radiator
Description:
132AB Series, 250mm wide x 30mm high ABL designed heat sinks increase surface area, allowing for larger area heat dissipation and faster cooling of components. Adopting tempered alloy design, it has higher thermal conductivity and can maximize cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. The high-power heat sink series adopts pressed heat dissipation fin technology to achieve a heat dissipation ratio and performance that exceeds that of a single extruded heat sink. ###Thermal resistance - up to 1 ° C/W
Description:
175mm Width x 30mm height, with mounting feet and heat sink section of 135 x 25mm (width x height) # # # Note that the thermal resistance value refers to the heat sink installed in natural ventilation and vertically. The length dimension refers to the size that extends along the direction of the heat sink. ###Thermal resistance - up to 1 ° C/W
Description:
160mm Width x 40mm height # # # Note: The thermal resistance quoted includes exposed vertical heat dissipation fins. The length dimension refers to the protruding length of the heat dissipation fins. ###Thermal resistance - up to 1 ° C/W
Description:
150AB Series, 96mm wide x 40mm high ABL, with its heat sink designed to increase surface area, thus providing a larger heat dissipation area for rapid cooling of components. The design adopts tempered alloy, which has greater thermal conductivity and maximizes cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. ###Thermal resistance - up to 1 ° C/W
Description:
54mm Width x 38mm height # # # Note: The thermal resistance quoted includes exposed vertical heat dissipation fins. The length dimension refers to the protruding length of the heat dissipation fins. ###Thermal resistance 1.3 ° C/W
Description:
BGA Heatsink, Flip Chip Flip chip type BGA heatsink suitable for high-power LED package cooling and various other applications. ### BGA radiator
Description:
155AB The ABL designed heat sink with a width of 100mm and a height of 40mm in the series increases the surface area, allowing for larger heat dissipation and faster cooling of components. Adopting tempered alloy design, it has higher thermal conductivity and can maximize cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. The high-power heat sink series adopts pressed heat dissipation fin technology to achieve a heat dissipation ratio and performance that exceeds that of a single extruded heat sink. ###Thermal resistance - up to 1 ° C/W
Description:
113AB Series, the 150mm wide x 25mm high ABL designed heat sink increases surface area, allowing for larger heat dissipation and faster cooling of components. Adopting tempered alloy design, it has higher thermal conductivity and can maximize cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. The high-power heat sink series adopts pressed heat dissipation fin technology to achieve a heat dissipation ratio and performance that exceeds that of a single extruded heat sink. ###Thermal resistance - up to 1 ° C/W
Description:
BGA Heatsink, Push Pin Push pin type BGA heatsink suitable for surface mount chip cooling and various other applications. ### BGA radiator
Description:
88mm Width x 35mm height, with ABL pipes designed to increase the surface area of the radiator, thus providing a larger heat dissipation area for rapid cooling of the component. The design adopts tempered alloy, which has greater thermal conductivity and maximizes cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. ###The referenced thermal resistance includes exposed vertical heat dissipation fins. The length dimension refers to the protruding length of the heat dissipation fins. ###Thermal resistance 1.3 ° C/W
Description:
164AB Series, 300mm wide x 25mm high ABL designed heat sinks increase surface area, allowing for larger area heat dissipation and faster cooling of components. Adopting tempered alloy design, it has higher thermal conductivity and can maximize cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. The high-power heat sink series adopts pressed heat dissipation fin technology to achieve a heat dissipation ratio and performance that exceeds that of a single extruded heat sink. ###Thermal resistance - up to 1 ° C/W
Description:
177AB The ABL designed heat sink with a width of 300mm and a height of 83mm in the series increases the surface area, allowing for larger heat dissipation and faster cooling of components. Adopting tempered alloy design, it has higher thermal conductivity and can maximize cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. The high-power heat sink series adopts pressed heat dissipation fin technology to achieve a heat dissipation ratio and performance that exceeds that of a single extruded heat sink. ###Thermal resistance - up to 1 ° C/W
Description:
173AB Series, universal 119mm wide x 64.5mm high ABL, its heat sink is designed to increase surface area, thus providing a larger heat dissipation area for rapid cooling of components. The design adopts tempered alloy, which has greater thermal conductivity and maximizes cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. ###The thermal resistance value mentioned is under natural ventilation and vertical installation of the heat sink. The length dimension refers to the size that extends along the direction of the heat sink. ###Thermal resistance - up to 1 ° C/W
Description:
ABL Design its heat sink to increase surface area, thus providing a larger heat dissipation area for rapid cooling of components. The design adopts tempered alloy, which has greater thermal conductivity and maximizes cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. ###The thermal resistance value mentioned is under natural ventilation and vertical installation of the heat sink. The length dimension refers to the size that extends along the direction of the heat sink. Pre drilled holes, one TO3 metal can be packaged in semiconductor. ###Thermal resistance 1.3 ° C/W
