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Description 177AB The ABL designed heat sink with a width of 300mm and a height of 83mm in the series increases the surface area, allowing for larger heat dissipation and faster cooling of components. Adopting tempered alloy design, it has higher thermal conductivity and can maximize cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. The high-power heat sink series adopts pressed heat dissipation fin technology to achieve a heat dissipation ratio and performance that exceeds that of a single extruded heat sink. ###Thermal resistance - up to 1 ° C/W
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Packaging method
Standard packaging quantity 1
768.2  yuan 768.2yuan
1+:
$ 875.7457
10+:
$ 845.0178
50+:
$ 841.1768
100+:
$ 837.3358
150+:
$ 831.1902
250+:
$ 825.8129
500+:
$ 820.4355
1000+:
$ 814.2899
Quantity
1+
10+
50+
100+
150+
Price
$875.7457
$845.0178
$841.1768
$837.3358
$831.1902
Price $ 875.7457 $ 845.0178 $ 841.1768 $ 837.3358 $ 831.1902
Start batch production 1+ 10+ 50+ 100+ 150+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(9119) Minimum order quantity(1)
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Technical parameters/thermal resistance: 0.09 ℃/W

External dimensions/length: 150 mm

External dimensions/width: 300 mm

External dimensions/height: 83 mm

Physical parameters/materials: Aluminum

Compliant with standards/RoHS standards: RoHS Compliant

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