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Description 164AB Series, 300mm wide x 25mm high ABL designed heat sinks increase surface area, allowing for larger area heat dissipation and faster cooling of components. Adopting tempered alloy design, it has higher thermal conductivity and can maximize cooling performance. Heat sinks can be used to cool high-power semiconductors, optoelectronic devices, and light-emitting diodes. The high-power heat sink series adopts pressed heat dissipation fin technology to achieve a heat dissipation ratio and performance that exceeds that of a single extruded heat sink. ###Thermal resistance - up to 1 ° C/W
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Standard packaging quantity 1
132.44  yuan 132.44yuan
1+:
$ 152.3014
10+:
$ 148.3283
50+:
$ 145.2823
100+:
$ 144.2228
200+:
$ 143.4282
500+:
$ 142.3687
1000+:
$ 141.7065
2000+:
$ 141.0443
Quantity
1+
10+
50+
100+
200+
Price
$152.3014
$148.3283
$145.2823
$144.2228
$143.4282
Price $ 152.3014 $ 148.3283 $ 145.2823 $ 144.2228 $ 143.4282
Start batch production 1+ 10+ 50+ 100+ 200+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(6693) Minimum order quantity(1)
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Technical parameters/thermal resistance: 0.21 ℃/W

External dimensions/length: 100 mm

External dimensions/width: 300 mm

External dimensions/height: 25 mm

Physical parameters/materials: Aluminum

Compliant with standards/RoHS standards: RoHS Compliant

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