Technical parameters/power supply voltage: | 2.5 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | BGA-356 |
|
Dimensions/Packaging: | BGA-356 |
|
Physical parameters/operating temperature: | 0℃ ~ 70℃ |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EPF10K200SBC356-2
|
Altera | 完全替代 | BGA-356 |
FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs
|
||
|
|
Intel | 完全替代 | BGA |
FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs
|
||
EPF10K200SBC356-2X
|
Altera | 类似代替 | BGA |
FPGA FLEX 10KE Family 200K Gates 9984 Cells 200MHz 0.22um Technology 2.5V 356Pin BGA
|
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