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Model EPF10K200SBC356-2
Description Loadable PLD, 0.6ns, CMOS, PBGA356, 35 X 35 MM, 1.27 MM PITCH, BGA-356
Product QR code
Brand: Intel
Packaging BGA
Delivery time
Packaging method
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(4282) Minimum order quantity(1)
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Technical parameters/operating temperature (Max):

85 ℃

 

Technical parameters/operating temperature (Min):

0 ℃

 

Package parameters/number of pins:

356

 

Encapsulation parameters/Encapsulation:

BGA

 

Dimensions/Packaging:

BGA

 

Other/Product Lifecycle:

Obsolete

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
EPF10K200SBC356-2 EPF10K200SBC356-2 Altera 类似代替 BGA-356
FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs
EPF10K200SBC356-2 EPF10K200SBC356-2 Intel 类似代替 BGA
FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs
EPF10K200SBC356-3 EPF10K200SBC356-3 Altera 完全替代 BGA-356
Loadable PLD, 0.8ns, CMOS, PBGA356, 35 X 35MM, 1.27MM PITCH, BGA-356

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