Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | 3A001 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 功能相似 | SDBRZ-48 |
SRAM Chip Async Dual 5V 32Kbit 4K x 8 70ns 48Pin SBCDIP Tube
|
||
IDT7134LA70CB
|
Integrated Device Technology | 功能相似 | DIP |
高速4K ×8双端口静态SRAM HIGH-SPEED 4K x 8 DUAL-PORT STATIC SRAM
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review