Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 功能相似 | DIP |
高速4K ×8双端口静态SRAM HIGH-SPEED 4K x 8 DUAL-PORT STATIC SRAM
|
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