Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -25 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 9
Encapsulation parameters/Encapsulation: SIP-9
External dimensions/height: 14.7 mm
External dimensions/packaging: SIP-9
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Other/Manufacturing Applications: *
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8351/N6,112
|
NXP | 功能相似 | SIP-9 |
IC DC COUPLED V-DEFL 9-SIL
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||
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|
Trident Microsystems | 功能相似 |
IC VERTICAL DEFLECTION IC, PZIP9, POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9Pin, Deflection IC
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NXP | 功能相似 | SIP-9 |
IC VERTICAL DEFLECTION IC, PZIP9, POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9Pin, Deflection IC
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