Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: SIP-9
External dimensions/packaging: SIP-9
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Other/Manufacturing Applications: *
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8351/N6,112
|
NXP | 功能相似 | SIP-9 |
IC DC COUPLED V-DEFL 9-SIL
|
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