Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT72T36115L10BB
|
Integrated Device Technology | 功能相似 | BGA |
2.5伏高速TeraSyncTM FIFO的36位配置 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS
|
||
IDT72T36115L4-4BBG
|
Integrated Device Technology | 功能相似 | BGA |
IC FIFO 131072X18 SYNC 240BGA
|
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