Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Integrated Device Technology | 功能相似 | BGA |
FIFO, 128KX36, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19MM, 1MM PITCH, GREEN, PLASTIC, BGA-240
|
||
IDT72T36115L10BB
|
Integrated Device Technology | 功能相似 | BGA |
2.5伏高速TeraSyncTM FIFO的36位配置 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS
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