Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HVQCCN
External dimensions/packaging: HVQCCN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89832UMG
|
Micrel | 功能相似 | MLF-16 |
MICREL SEMICONDUCTOR SY89832UMG 芯片, 缓冲驱动器, LVDS, 16-MLF
|
||
|
|
Microchip | 功能相似 | HVQCCN |
2.5V/3.3V TWO INPUT, 1GHz LVTTL/CMOSTO-LVPECL 1:4 FANOUT BUFFER/TRANSLATOR WITH 2:1INPUT MUX
|
||
SY89834UMGTR
|
Micrel | 功能相似 | HVQCCN |
2.5V/3.3V TWO INPUT, 1GHz LVTTL/CMOSTO-LVPECL 1:4 FANOUT BUFFER/TRANSLATOR WITH 2:1INPUT MUX
|
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