Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HVQCCN
External dimensions/packaging: HVQCCN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89832UMGTR
|
Micrel | 功能相似 | HVQCCN |
2.5V 1:4 LVDS Fanout Buffer (I Temp Green)
|
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