Technical parameters/contact type: DPST
Technical parameters/number of circuits: 2
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape, Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY100EL56VZC
|
Microchip | 完全替代 | SOIC-20 |
IC MUX 2:1 DUAL 3.3V/5V 20-SOIC
|
||
SY100EL57LZC
|
Microchip | 完全替代 | SOIC-16 |
IC MULTIPLXR 4:1/2:1 DIFF 16SOIC
|
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