Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOIC-20
External dimensions/height: 2.26 mm
External dimensions/packaging: SOIC-20
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY100EL56VZG
|
Micrel | 类似代替 | SOIC-20 |
ECL: 20引脚 SOIC、3.3 V和5 V
|
||
SY100EL56VZG
|
Microchip | 类似代替 | SOIC-20 |
ECL: 20引脚 SOIC、3.3 V和5 V
|
||
SY100EL57ZG
|
Micrel | 功能相似 | SOIC-16 |
Multiplexer 1Element ECL 4IN 16Pin SOIC N
|
||
SY100EL57ZG
|
Microchip | 功能相似 | SOIC-16 |
Multiplexer 1Element ECL 4IN 16Pin SOIC N
|
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