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Description High density and high-performance ARM based 32-bit MCU with 256 to 512KB flash memory, USB, CAN, 11 timers, 3 ADCs, and 13 communication interfaces High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
Product QR code
Packaging BGA-100
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
26.83  yuan 26.83yuan
5+:
$ 31.3911
50+:
$ 30.0496
200+:
$ 29.2984
500+:
$ 29.1106
1000+:
$ 28.9227
2500+:
$ 28.7081
5000+:
$ 28.5740
7500+:
$ 28.4398
Quantity
5+
50+
200+
500+
1000+
Price
$31.3911
$30.0496
$29.2984
$29.1106
$28.9227
Price $ 31.3911 $ 30.0496 $ 29.2984 $ 29.1106 $ 28.9227
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(6328) Minimum order quantity(5)
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Technical parameters/frequency: 72 MHz

Technical parameters/RAM size: 64 KB

Technical parameters/digits: 32

Technical parameters/dissipated power: 500 mW

Technical parameters/FLASH memory capacity: 384 KB

Technical parameters/Analog to Digital Conversion (ADC): 3

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Technical parameters/dissipated power (Max): 500 mW

Technical parameters/Digital to Analog Conversion (DAC): 2

Technical parameters/power supply voltage (Max): 3.6 V

Technical parameters/power supply voltage (Min): 2 V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 100

Encapsulation parameters/Encapsulation: BGA-100

External dimensions/length: 10 mm

External dimensions/width: 10 mm

External dimensions/height: 1.09 mm

External dimensions/packaging: BGA-100

Physical parameters/operating temperature: -40℃ ~ 85℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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