Technical parameters/RAM size: | 64 KB |
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Technical parameters/dissipated power: | 500 mW |
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Technical parameters/Analog to Digital Conversion (ADC): | 3 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 500 mW |
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Technical parameters/Digital to Analog Conversion (DAC): | 2 |
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Package parameters/number of pins: | 100 |
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Encapsulation parameters/Encapsulation: | LFBGA-100 |
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Dimensions/Packaging: | LFBGA-100 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
STM32F103VDH6TR
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ST Microelectronics | 完全替代 | BGA-100 |
高密度高性能线的基于ARM的32位MCU,具有256至512KB闪存, USB , CAN ,11个定时器, 3的ADC ,13个通信接口 High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
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