Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SST39VF200A-70-4C-B3KE
|
Silicon Storage Tech | 功能相似 | TFBGA |
128Kx16 闪存 2K字 扇区
|
||
SST39VF200A-70-4C-B3KE
|
Microchip | 功能相似 | TFBGA-48 |
128Kx16 闪存 2K字 扇区
|
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