Technical parameters/access time: 70.0 ns
Technical parameters/memory capacity: 2000000 B
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray, Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SST39VF200A-70-4C-B3KE
|
Silicon Storage Tech | 功能相似 | TFBGA |
128Kx16 闪存 2K字 扇区
|
||
SST39VF200A-70-4C-B3KE
|
Microchip | 功能相似 | TFBGA-48 |
128Kx16 闪存 2K字 扇区
|
||
SST39VF200A-70-4C-B3KE-T
|
Microchip | 完全替代 | TFBGA-48 |
Flash Parallel 3.3V 2Mbit 128K x 16Bit 70ns 48Pin TFBGA T/R
|
||
SST39VF200A-70-4C-MAQE
|
Microchip | 完全替代 | WFBGA-48 |
Flash Parallel 3.3V 2M-bit 128K x 16 70ns 48Pin WFBGA
|
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