Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP-6
External dimensions/packaging: TSOP-6
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI3585CDV-T1-GE3
|
Vishay Semiconductor | 完全替代 | TSOP |
MOSFET N/P-CH 20V 3.9A 6TSOP
|
||
SI3588DV-T1-GE3
|
VISHAY | 完全替代 | TSOP-6 |
MOSFET N/P-CH 20V 2.5A 6-TSOP
|
||
SI3588DV-T1-GE3
|
Vishay Semiconductor | 完全替代 | TSOP |
MOSFET N/P-CH 20V 2.5A 6-TSOP
|
||
SI3850ADV-T1-GE3
|
Vishay Siliconix | 完全替代 | TSOT-23-6 |
MOSFET N/P-CH 20V 1.4A 6-TSOP
|
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