Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FBGA-64
External dimensions/packaging: FBGA-64
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MMBFJ310
|
PANJIT Touch Screens | 功能相似 |
Transistor
|
|||
MMBFJ310
|
Fairchild | 功能相似 | SOT-23-3 |
Transistor
|
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