Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Spansion | 功能相似 | LBGA |
NOR Flash Parallel 3V 2G-bit 256M/128M x 8Bit/16Bit 110ns 64Pin FBGA T/R
|
||
S70GL02GS11FHI013
|
Cypress Semiconductor | 功能相似 | BGA |
NOR Flash Parallel 3V 2G-bit 256M/128M x 8Bit/16Bit 110ns 64Pin FBGA T/R
|
||
S70GL02GS11FHI020
|
Spansion | 功能相似 | FBGA |
NOR Flash Parallel 3V/3.3V 2Gbit 256M/128M x 8Bit/16Bit 110ns 64Pin FBGA Tray
|
||
S70GL02GS12FHIV20
|
Cypress Semiconductor | 功能相似 | FBGA-64 |
S70GL02GS 系列 2Gb (256 M x 8/128 M x 16) 3.6V MirrorBit® 闪存 -FBGA-64
|
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