Technical parameters/digits: 8
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 63
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S34MS04G200BHI000
|
Cypress Semiconductor | 完全替代 | BGA-63 |
闪存, 与非, SLC NAND, 4 Gbit, 64M x 8位, 并行, BGA, 63 引脚
|
||
S34MS04G200BHI000
|
Spansion | 完全替代 | BGA-63 |
闪存, 与非, SLC NAND, 4 Gbit, 64M x 8位, 并行, BGA, 63 引脚
|
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